IKATAN DIFUSI VAKUM, juga dikenal sebagai VDDBOND, adalah teknologi koneksi canggih yang banyak digunakan dalam mikroelektronika, nanoelektronika, optoelektronika, biomedis, dan bidang lainnya. Teknologi ini menciptakan koneksi tingkat atom antara dua atau lebih bahan untuk mencapai sifat listrik dan stabilitas mekanik yang sangat baik.

The basic principle of IKATAN DIFUSI VAKUM is to perform high-temperature heat treatment in a vacuum to diffuse and rearrange atoms on the surface of the material to achieve connection. This method eliminates residual stress between interfaces and results in a flat, defect-free interface. By controlling the time and temperature of the heat treatment, the mechanical and electrical properties of the connection can be optimized.

The advantage of this technology is its high accuracy and reliability. Since it is performed in a vacuum, it prevents oxidation and contamination, thereby increasing the stability and durability of the connection. IKATAN DIFUSI VAKUM can form large area connections, which makes it ideal for mass production.

In the biomedical field, IKATAN DIFUSI VAKUM is used to manufacture high-precision biosensors and bioelectronic devices. These devices need to operate within the human body and therefore need to be highly stable and durable. By using IKATAN DIFUSI VAKUM, the interfaces of these devices can be ensured with atomic-level precision while providing excellent electrical performance and mechanical stability.